Manufacturing & Assembly Capabilities
Specifications built to meet demanding designs.
PCB Manufacturing
Board Layers
1 - 40 Layers
Board Type
Rigid, Flex, Rigid-Flex, HDI
Material
FR4, Rogers, Aluminum, Polyimide
Board Thickness
0.2 - 3.2 mm
Min Trace / Space
3 / 3 mil
Surface Finish
HASL, ENIG, OSP, Immersion Silver
Min Hole
0.15 mm
Copper Thickness
0.5 - 6 oz
PCB Assembly
Assembly Options
SMT, THT, Mixed
Component Size
01005, BGA, Fine Pitch
Mounting Min Pitch
0.20 mm ± 0.02 mm
Placement Accuracy
± 0.03 mm
Testing
AOI, X-Ray, ICT, FCT
Soldering
Lead-free reflow
Conformal Coating
Available
AOI Coverage
100%
Materials & Standards
Certifications
ISO9001, UL, RoHS, IPC-A-610
Automotive
IATF16949 capable
Lead Time
24h quick-turn available
Quality Rate
99.5%+ first pass yield
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